I. Incoming Quality Control (IQC)
1.Key components testing
LED chip: LM-80 light decay test (3000 hours decay rate ≤ 3%)
Driver power supply: full load aging test (48 hours uninterrupted operation)
Heat sink: thermal conductivity test (≥180W/m-K)
2.Material Compliance Verification
ROHS2.0 Hazardous Substance Testing (XRF Spectrum Analyzer)
Lens transmittance test (spectrophotometer test ≥ 92%)

Second, process quality control (IPQC)
1.SMT process
3D inspection of solder joints (AOI equipment to identify false soldering/offset defects)
Patch precision control (±0.01mm coordinate tolerance)
2.Assembly process
Air tightness test (IP65 grade 50kPa water pressure test)
Spectral consistency screening (integrating sphere detection wavelength deviation ±5nm)

Finished product quality control (OQC)
1.Performance Test
Photon flux density test (multi-point matrix measurement of PPFD value)
Thermal shock test (-30℃~85℃ cycle 20 times)
2.Reliability verificationAccelerated aging test (3000 hours @ 120% of rated power)
Vibration test (simulated transportation environment 3 axes 6 hours)

IV. Quality Tracing System
1.MES system records key process parameters (traceability accuracy up to single-piece level)
2.QR code quality file (including all testing data and operator information)